Capabilities and Offerings
- Flip Chip & WLP Technology
Selection
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Selecting
the best available technology for your product application and then
assisting you with the sourcing of that technology based on your
requirements.
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- Flip Chip & WLP Technology
Sourcing
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Assisting
you with the sourcing of the correct bumping technology based on your
production requirements. This can include out-sourcing
strategies, internal production and/or licensing of the appropriate
technology.
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- Advanced IC Package Failure Analysis and Problem
Resolution
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Our expertise will help you resolve your technical issues quickly,
improving your time-to-market and customer satisfaction. We have
seen many flip chip and WLP issues that allow for rapid resolution of
your problems.
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Market and Technology
Seminars
Personalized training programs on all aspects of cutting-edge technology
and market development are available at your location.
Expert Witness
With
the growth in flip chip and wafer level packaging, litigation over patents and
other intellectual property issues is increasing. You have access to
experts from both the market and technical aspects of these technologies.
Retainer for Guaranteed Access
Yearly retainers are available to allow for long term guaranteed
access in the above areas. The retainers are structured based on
your needs.
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Ultra CSP® is a registered trademark of
Flip Chip International, L.L.C.
