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Peter EleniusPeter Elenius is a founder and managing partner at E&G Technology Partners, a firm specializing in technology commercialization and business development. Peter has broad experience
in the research and development of new technologies and products, most recently
as Vice President of Technology and Chief Technical Officer at Flip Chip
Technologies, L.L.C. (d.b.a. Kulicke and
Soffa’s Flip Chip Division). Prior to joining Flip Chip Technologies (FCT), he was the Flip Chip Product Manager at Kulicke & Soffa where he was instrumental in the formation of FCT. Previous to this he was responsible for the development of advanced flip chip manufacturing equipment and flip chip process development at IBM in both New York and Virginia. Peter is recognized
world wide as an expert in flip chip and wafer level packaging
technologies. He has spoken at numerous conferences and published many
papers in the field. He holds an MS degree in
Manufacturing Systems and a BS in Mechanical Engineering from the University of
Wisconsin – Madison. He
can be reached by email at Thomas GoodmanThomas Goodman is a founder and managing partner at E&G Technology Partners, a firm specializing in technology commercialization and business development. Goodman has extensive experience in the development of new products and
markets, most recently as Manager of Strategic Business Development at Flip Chip Technologies, L.L.C.
(d.b.a. Kulicke and
Soffa’s Flip Chip Division). Prior to joining Flip Chip Technologies (FCT), he was a Senior Technology Analyst at the market research firm TechSearch International, Inc., where he specialized in high density mounting technologies such as CSP and flip chip. His previous industry experience in research and development includes tenure
at Sony’s Central Research Laboratory in Goodman, an internationally known speaker and author on emerging technologies
and markets, holds several He holds an MS degree in Macromolecular Science and Engineering from
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E & G Technology Partners
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